The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 20, 2008
Filed:
Jul. 09, 2007
Robert S. Pauley, Mission Viejo, CA (US);
Jayesh R. Bhakta, Cerritos, CA (US);
William M. Gervasi, Ladera Ranch, CA (US);
Chi She Chen, Walnut, CA (US);
Jose Delvalle, Costa Mesa, CA (US);
Robert S. Pauley, Mission Viejo, CA (US);
Jayesh R. Bhakta, Cerritos, CA (US);
William M. Gervasi, Ladera Ranch, CA (US);
Chi She Chen, Walnut, CA (US);
Jose Delvalle, Costa Mesa, CA (US);
Netlist, Inc., Irvine, CA (US);
Abstract
A module is electrically connectable to a computer system. The module includes at least one multilayer structure having a plurality of electrical contacts which are electrically connectable to the computer system. The module further includes a first printed circuit board coupled to the at least one multilayer structure. The first printed circuit board has a first surface and a first plurality of components mounted on the first surface. The first plurality of components is in electrical communication with the electrical contacts. The module further includes a second printed circuit board coupled to the at least one multilayer structure. The second printed circuit board has a second surface and a second plurality of components mounted on the second surface. The second plurality of components is in electrical communication with the electrical contacts. The second surface of the second printed circuit board faces the first surface of the first printed circuit board. The module further includes at least one thermally conductive layer positioned between the first plurality of components and the second plurality of components. The at least one thermally conductive layer is in thermal communication with the first plurality of components, the second plurality of components, and the electrical contacts.