Brossard, Canada

William H Down


Average Co-Inventor Count = 1.9

ph-index = 3

Forward Citations = 61(Granted Patents)


Location History:

  • Quebec, CA (1984)
  • Brossard, CA (1985 - 1987)

Company Filing History:


Years Active: 1984-1987

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5 patents (USPTO):Explore Patents

Title: Innovations of William H Down

Introduction

William H Down is a notable inventor based in Brossard, Canada. He has made significant contributions to the field of wave soldering technology, holding a total of five patents. His work has greatly influenced the efficiency and effectiveness of soldering processes in electronic manufacturing.

Latest Patents

Among his latest patents are the "Solder pot for wave soldering machine" and the "Automatic wave soldering machine." The solder pot patent describes an automatic wave solder apparatus designed for printed circuit boards. This apparatus features a weir attached to the exit side of a discharge nozzle, which is spring-loaded for engagement with a stop member. The design allows the solder pot assembly to be lowered and swung out of the circuit board conveyor path for cleaning. Additionally, the automatic wave soldering machine patent outlines a system that includes a fluxer section, preheater section, and wave soldering section, all monitored by a microprocessor. This innovation ensures precise control over the soldering process, enhancing the quality of the final product.

Career Highlights

William H Down has dedicated his career to advancing soldering technology. His work at Electrovert Ltd. has positioned him as a key player in the industry. His inventions have streamlined processes and improved the reliability of soldering in electronic devices.

Collaborations

Throughout his career, William has collaborated with notable colleagues such as Armin Rahn and Marcel Drouin. These partnerships have fostered innovation and contributed to the development of advanced soldering solutions.

Conclusion

William H Down's contributions to wave soldering technology have made a lasting impact on the electronics manufacturing industry. His innovative patents and collaborative efforts continue to shape the future of soldering processes.

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