The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 30, 1986

Filed:

Feb. 28, 1983
Applicant:
Inventors:

Armin Rahn, St-Jean-Sur-Richelieu, CA;

William H Down, Brossard, CA;

Marcel Drouin, St.-Hubert, CA;

Matthew J Rudzicz, Montreal, CA;

John F Buszard, Ste-Anne de Bellevue, CA;

Elie Makhoul, Carignan, CA;

Ralph W Woodgate, Brewster, CA;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K / ; H05K / ; H05B / ;
U.S. Cl.
CPC ...
228-9 ; 219388 ; 219480 ; 228 37 ; 364477 ;
Abstract

Automatic wave solder apparatus having a fluxer section, preheater section and wave soldering section through which circuit boards are passed by a conveyor. All of the major process parameters are monitored by a microprocessor. One specific parameter controlled is the temperature of the boards exiting from the preheater system. Preheating is carried out by two axially spaced banks of heaters, the upstream one supplying the major quantity of heat and the downstream one supplying sufficient heat to boost the temperature to the desired value. A pyrometer located in the zone between the two banks of heaters measures the heat radiated from the boards and this information is converted by the microprocessor to an appropriate instruction to the second bank of heaters. The soldering section has a solder pot assembly particularly adapted to the automatic nature of the apparatus. The pot can be jacked to the correct height according to the length of leads projecting from the boards under control of the microprocessor. Irrespective of the solder pot height the structure of the solder nozzle ensures constant values for the rear flowing portion of the wave. The pot may be swung out for cleaning.


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