Electrovert Ltd.

William H Down

Armin Rahn

Marcel Drouin

Ralph W Woodgate

John F Buszard

Matthew J Rudzicz

Elie Makhoul

John Dickie

Automatic wave solder apparatus in which printed circuit boards are passed over a wave soldering section to apply solder to exposed metallic surfaces on the undersides of the surface of the board. A weir is attached to the exit side of a discharge nozzle for the solder wave which is spring loaded upwards for engagement with a stop member. The solder pot assembly may be lowered and swung out of a circuit board conveyor path for cleaning and both front plate and rear plate members on each side of the discharge nozzle are hinged so they can be raised for cleaning when the solder pot assembly is lowered. The stop member permits the discharge nozzle to be raised to different heights, but retains the spring loaded weir at the same height.

Solder pot for wave soldering machine

Automatic wave solder apparatus having a fluxer section, preheater section and wave soldering section through which circuit boards are passed by a conveyor. All of the major process parameters are monitored by a microprocessor. One specific parameter controlled is the temperature of the boards exiting from the preheater system. Preheating is carried out by two axially spaced banks of heaters, the upstream one supplying the major quantity of heat and the downstream one supplying sufficient heat to boost the temperature to the desired value. A pyrometer located in the zone between the two banks of heaters measures the heat radiated from the boards and this information is converted by the microprocessor to an appropriate instruction to the second bank of heaters. The soldering section has a solder pot assembly particularly adapted to the automatic nature of the apparatus. The pot can be jacked to the correct height according to the length of leads projecting from the boards under control of the microprocessor. Irrespective of the solder pot height the structure of the solder nozzle ensures constant values for the rear flowing portion of the wave. The pot may be swung out for cleaning.

Automatic wave soldering machine

Apparatus for treating electronic components comprises a frame, a lower track mounted on the frame for supporting the components, and an upper track mounted on the frame in a normal operating position above and in spaced-apart parallel relationship to the lower track. The lower and upper tracks define therebetween a path along which the components can pass for treatment. Pusher fingers are provided each having a portion which extends substantially horizontally in such a manner as to be insertable between the tracks and engageable with individual ones of the components. A drive is mounted on the frame for propelling the fingers. The components are held captive between the lower and upper tracks, and the fingers engage individual ones of the components and propel them along the path.

Lead tinning system

Wave soldering apparatus particularly adapted for soldering printed circuit boards which have closely packed chip components adhesively mounted on one side of the boards is described. A novel nozzle assembly is dimensioned to be mounted to the solder supply conduit of a conventional wave soldering reservoir. The nozzle assembly comprises a first nozzle which delivers a turbulent jet to the undersides of the printed circuit boards as they are conveyed over the nozzle assembly, and a second nozzle which delivers a smooth laminar wave through which the undersides of the printed circuit boards immediately subsequently pass. The turbulent jet forces solder into the restricted spaces at which chip component contact pads are located and the smooth wave completes this soldering action by building of additional solder in a manner which discourages the formation of solder 'icicles' and bridging.

Wave-soldering of printed circuit boards

A fixture for holding flexible printed circuit board substrates formed by front and rear screens each of a wire mesh material which are hingedly connected together and held at their top by a fastening arrangement such that the flexible substrate may be held therebetween, the material of the screen (e.g., titanium) being non-wettable by and capable of withstanding the temperature of molten solder.

Growing community of inventors

Brossard, Canada

William H Down