William Goodall, Iii

Title: Innovations of William Goodall, III

Introduction

William Goodall, III is a notable inventor based in Cary, NC (US), recognized for his contributions to integrated circuit design. With a total of 9 patents to his name, he has made significant advancements in the field of electronics and engineering.

Latest Patents

His latest patents include innovative methods for integrated circuit (IC) design using engineering change order (ECO) cell architectures. These methods feature a fill algorithm that is both single- and multi-row aware, taking into account a poly-pitch count and utilizing metallization of the 'empty space' relative to a suite of available fill cells. The algorithm is designed to be aware of timing critical logic elements, allowing for the strategic placement of ECO fill cells in proximity to timing-sensitive circuits. This flexibility enables the ECO cells to be repurposed as delay circuits or other functions to aid in margin control. Additionally, he has developed standard cell architecture for diffusion based on fin count, which supports multiple diffusion regions for n-type and p-type diffusions, enhancing the design capabilities of finfet based integrated circuits.

Career Highlights

Throughout his career, William Goodall, III has worked with prominent companies such as Qualcomm Incorporated and International Business Machines Corporation (IBM). His experience in these leading technology firms has contributed to his expertise in integrated circuit design and innovation.

Collaborations

He has collaborated with notable individuals in the industry, including Anthony Correale, Jr. and Benjamin Bowers, further enriching his professional network and enhancing his contributions to the field.

Conclusion

William Goodall, III's innovative work in integrated circuit design has significantly impacted the electronics industry. His patents reflect a deep understanding of engineering principles and a commitment to advancing technology.