Greentown, IN, United States of America

William David Higdon


Average Co-Inventor Count = 3.1

ph-index = 9

Forward Citations = 502(Granted Patents)


Company Filing History:


Years Active: 1983-2004

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9 patents (USPTO):Explore Patents

Title: The Innovations of William David Higdon

Introduction

William David Higdon is a notable inventor based in Greentown, Indiana, with a remarkable portfolio of nine patents. His work primarily focuses on advancements in semiconductor technology, particularly in the area of solder bumping methods and structures.

Latest Patents

Higdon's latest patents include a groundbreaking invention titled "Flip-chip interconnected with increased current-carrying capability." This invention features a metal runner designed to enhance the current-carrying capability of solder bumps, which are essential for connecting surface-mount circuit devices to substrates. The runner consists of a leg portion and a pad portion, with the pad portion containing a continuous region and multiple separate electrical paths. These paths are strategically delineated by nonconductive regions, which help to distribute current flow and reduce the risk of electromigration.

Another significant patent is the "Surface bumping method and structure formed thereby." This method addresses fine solder bump pitches and involves a semiconductor device with a solderable metal layer. The process includes forming a sacrificial layer, creating a plating seed layer, and depositing solder material, ultimately leading to the formation of a solder bump.

Career Highlights

Throughout his career, Higdon has worked with prominent companies such as Delco Electronics Corporation and Delphi Technologies, Inc. His contributions to these organizations have significantly advanced the field of electronics and semiconductor manufacturing.

Collaborations

Higdon has collaborated with esteemed colleagues, including Shing Yeh and Frank Stepniak, further enhancing the innovative work produced in his field.

Conclusion

William David Higdon's contributions to semiconductor technology through his patents and collaborations have made a lasting impact on the industry. His innovative approaches continue to influence advancements in electronic manufacturing.

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