Spokane, WA, United States of America

William B Willett


Average Co-Inventor Count = 4.1

ph-index = 5

Forward Citations = 102(Granted Patents)


Company Filing History:


Years Active: 2002-2010

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5 patents (USPTO):Explore Patents

Title: The Innovations of William B. Willett: Engineering the Future of Sputtering Targets

Introduction

William B. Willett, a notable inventor residing in Spokane, WA, has made remarkable contributions to the field of materials science and engineering. With a portfolio of five patents, his work centers primarily on the development of advanced sputtering targets, crucial components in various high-tech applications, including semiconductors and thin-film technology.

Latest Patents

Willett’s most recent inventions include innovative copper sputtering targets and methods for forming these pivotal materials. One of his key patents describes a copper-comprising sputtering target that boasts an impressive composition of at least 99.99% copper by weight, accompanied by specific grain size features ranging from 1 micron to 50 microns. These targets exhibit a yield strength of 15 ksi or greater and a Brinell hardness exceeding 40, showcasing their durability and performance.

Additionally, Willett has explored the realm of copper alloy sputtering targets, which consist of 99.99% copper and a precise total alloying element range. These advancements not only enhance the efficiency of sputtering processes but also ensure uniformity in grain size, critical for consistent performance in industrial applications. His innovative approaches also include the production methods for bonded and monolithic targets, such as using equal channel angular extrusion, further highlighting his inventive prowess.

Career Highlights

Throughout his career, Willett has been associated with Honeywell International Inc., where he has leveraged his expertise to push the boundaries of material science. His insights and innovative methods have been vital for the company’s research and development initiatives, particularly in the domain of metallurgical engineering.

Collaborations

Willett has collaborated with esteemed colleagues, including Vladimir M. Segal and Stephane Ferrasse, further enriching the innovation landscape within which he operates. These partnerships have fostered a collaborative environment that is essential for advancement in technology and material applications.

Conclusion

William B. Willett stands as a testament to the power of innovation in engineering. His contributions through his patents not only enhance current technologies but also lay the groundwork for future developments in sputtering targets and related fields. His work at Honeywell and collaborations with fellow inventors continue to drive progress, making significant impacts in various high-tech industries.

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