Honeywell International Inc.

William B Willett

Stephane Ferrasse

Vladimir M Segal

Michael R Pinter

Nancy F Dean

Charles Smith

Amy Gettings

Susan D Strothers

Chi Tse Wu

Wuwen Yi

Frank A Alford

The invention includes a copper-comprising sputtering target. The target is monolithic or bonded and contains at least 99.99% copper by weight and has an average grain size of from 1 micron to 50 microns. The copper-comprising target has a yield strength of greater than or equal to about 15 ksi and a Brinell hardness (HB) of greater than about 40. The invention includes copper alloy monolithic and bonded sputtering targets consisting essentially of less than or equal to about 99.99% copper by weight and a total amount of alloying element(s) of at least 100 ppm and less than 10% by weight. The targets have an average grain size of from less than 1 micron to 50 microns and have a grain size non-uniformity of less than about 15% standard deviation (1-sigma) throughout the target. The invention additionally includes methods of producing bonded and monolithic copper and copper alloy targets.

Copper sputtering targets and methods of forming copper sputtering targets

Described is a high quality sputtering target and method of manufacture which involves application of equal channel angular extrusion.

Sputtering targets formed from cast materials

Methods of fabricating articles and sputtering targets

Described is a transferrable fibrous thermal interface. The interface comprises flocked thermally conductive fibers embedded in an adhesive in substantially vertical orientation with portions of the fibers extending out of the adhesive. An encapsulant fills spaces between the portions of the fibers that extend out of the adhesive and a release liner is on at least one outer surface of the interface.

Transferrable compliant fibrous thermal interface

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Spokane, WA, United States of America

William B Willett