Will Kiang Wong

Title: The Innovations of Will Kiang Wong

Introduction

Will Kiang Wong is a prominent inventor based in Belmont, California. He has made significant contributions to the field of optoelectronics and semiconductor packaging. With a total of 10 patents to his name, Wong has established himself as a key figure in technological advancements.

Latest Patents

Wong's latest patents include an optoelectronic package and a thin foil semiconductor package. The optoelectronic package features an inner package with a dielectric substrate that houses a photodetector die. This design includes routing connections to external bond pads, ensuring efficient functionality. The outer package incorporates a ceramic substrate with a light source die, strategically positioned for optimal performance.

The thin foil semiconductor package introduces an innovative approach by incorporating a metallic foil into the design. This apparatus utilizes a carrier embossed with cavities that support the metallic foil, allowing for integrated circuit dice to be attached effectively. The bonding wires connect the integrated circuit dice to the foil, enhancing the overall performance of the semiconductor package.

Career Highlights

Wong has worked with notable companies such as National Semiconductor Corporation and Texas Instruments Corporation. His experience in these organizations has contributed to his expertise in the field of electronics and semiconductor technology.

Collaborations

Wong has collaborated with talented individuals, including Jaime A Bayan and Nghia Thuc Tu. These partnerships have likely fostered innovation and creativity in his projects.

Conclusion

Will Kiang Wong's contributions to the field of optoelectronics and semiconductor packaging are noteworthy. His innovative patents and career achievements reflect his dedication to advancing technology. Wong's work continues to influence the industry and inspire future inventors.