Shanghai, China

Wenliang Dai

This inventor holds 5 USPTO granted patents and 10 published patent applications. Top assignees: Cadence Design Systems, Inc., Xpeedic Co., Ltd.. Active years: 2013-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Wenliang Dai. Retrieved from https://idiyas.com/inventor/wenliang-dai

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 5 

% Patents Active = 60.0

Average Co-Inventor Count = 5.5

ph-index = 4

Forward Citations = 40(Granted Patents)


Company Filing History:


Years Active: 2013-2024

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5 patents (USPTO):Explore Patents

Title: Wenliang Dai: Semiconductor Design and Power Network Analysis

Introduction

Wenliang Dai is an inventor associated with Shanghai, China, whose patent work includes methods for semiconductor simulation and power delivery network analysis. His portfolio includes 5 patents.

Latest Patents

One of Dai’s latest patents, “Method for Real-Time Extraction of On-Chip Simulation Information,” describes extracting key simulation results while a simulation is running. The method analyzes job options and parameters, scans log files for relevant information, and formats the results. This can help users monitor progress, decide whether to continue or stop a task, and adjust workflows to improve design efficiency.

Another patent, “Method and System for Power Delivery Network Analysis,” concerns computer-based analysis of power delivery network systems. It describes receiving chip, package, and board power models and co-simulating at least two of them to support analysis across these components.

Career Highlights

Dai’s work is connected with Cadence Design Systems, Inc. and Xpeedic Co., Ltd. His patent topics reflect a focus on electronic design automation, simulation workflows, and power delivery network analysis.

Collaborations

Dai’s listed coworkers include Zhongyong Zhou and Dennis Nagle.

Conclusion

Wenliang Dai’s patents address practical challenges in semiconductor design by supporting real-time simulation monitoring and coordinated analysis of power delivery networks.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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