Wen-Yao Chang

Title: The Innovations of Wen-Yao Chang

Introduction

Wen-Yao Chang is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of five patents. His work focuses on advanced manufacturing methods and innovative designs that enhance the performance and reliability of semiconductor devices.

Latest Patents

One of his latest patents is a semiconductor die package and method of manufacture. In this embodiment, an interposer features a first side with a first integrated circuit device attached using a first set of conductive connectors. Each connector in this set has a specific height. Additionally, a first die package is attached to the same side of the interposer with a second set of conductive connectors. This second set includes a first conductive connector and a second conductive connector, each with different heights. A first dummy conductive connector is positioned between the interposer and the die package. The design also incorporates an underfill beneath both the integrated circuit device and the die package, along with an encapsulant surrounding them.

Career Highlights

Wen-Yao Chang has worked with notable companies such as Taiwan Semiconductor Manufacturing Company Ltd. and the Industrial Technology Research Institute. His experience in these organizations has allowed him to develop and refine his innovative ideas in semiconductor technology.

Collaborations

Throughout his career, Wen-Yao has collaborated with talented individuals, including Chien Rhone Wang and Kewei Zuo. These partnerships have contributed to the advancement of his projects and the successful implementation of his inventions.

Conclusion

Wen-Yao Chang's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the field. His innovative approaches continue to shape the future of semiconductor manufacturing.