Wen Wu

Title: The Innovative Contributions of Wen Wu

Introduction

Wen Wu is a prominent inventor based in Milpitas, CA (US), known for her significant contributions to semiconductor technology. With a total of 4 patents, she has made remarkable advancements in the field, particularly in the deposition of metal seed layers and copper seed layers for interconnect structures.

Latest Patents

Wen Wu's latest patents include a multistep method of depositing metal seed layers. This innovative method involves at least three operations to deposit metal seed layers on a semiconductor substrate with recessed features. The process begins with the deposition of a first layer of metal, which is then redistributed to enhance sidewall coverage. Following this, a second layer of metal is deposited, leading to improved step coverage and reduced void formation in interconnects. This method ultimately enhances the resistance characteristics of integrated circuit devices.

Another notable patent focuses on the deposition of doped copper seed layers, which improves the reliability of copper interconnect structures. This method involves creating a copper seed bilayer on a barrier layer within a recessed feature of a semiconductor substrate. The bilayer consists of a copper alloy seed layer topped with a pure copper seed layer. This innovative approach results in reduced line resistance and better electromigration performance compared to conventional methods.

Career Highlights

Wen Wu is currently employed at Novellus Systems Incorporated, where she continues to push the boundaries of semiconductor technology. Her work has been instrumental in developing methods that enhance the performance and reliability of integrated circuits.

Collaborations

Wen has collaborated with notable colleagues, including Girish Anant Dixit and Robert T Rozbicki, contributing to a dynamic and innovative work environment.

Conclusion

Wen Wu's contributions to semiconductor technology through her patents and innovative methods have significantly impacted the industry. Her work continues to pave the way for advancements in integrated circuit performance and reliability.