Wen Luh Yang

Title: Innovations of Wen Luh Yang

Introduction

Wen Luh Yang is a notable inventor based in Chingshuei Jen, Taiwan. He has made significant contributions to the field of electrochemical deposition techniques, particularly in the area of copper interconnecting wires. With a total of 2 patents, his work has implications for improving the efficiency and effectiveness of electronic components.

Latest Patents

Wen Luh Yang's latest patents include a molding technique for copper interconnecting wires by electrochemical displacement deposition on the pre-shaped metal layer. This innovative technique is designed to form an adhering layer on a substrate and a sacrificial layer on the adhering layer. The sacrificial layer is then patterned according to the copper interconnecting wires and displaced to create the wires in a specific chemical solution. Another significant patent is the oxygen-removing pre-process for copper interconnect grown by electrochemical displacement deposition. This process involves heating a solvent, such as deionized water, to remove dissolved oxygen before preparing plating solutions. The result is a substantial improvement in the resistance of the copper grown from the EDD solutions, achieving values very close to copper's ideal resistance.

Career Highlights

Wen Luh Yang is affiliated with Feng Chia University, where he continues to advance research in his field. His work has garnered attention for its practical applications in electronics and materials science.

Collaborations

Wen Luh Yang has collaborated with notable colleagues, including Don-Gey Liu and Tsong-Jen Yang. These collaborations have contributed to the development of innovative techniques and solutions in their respective fields.

Conclusion

Wen Luh Yang's contributions to the field of electrochemical deposition and his innovative patents highlight his role as a significant inventor in Taiwan. His work continues to influence advancements in electronic component manufacturing.