The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 28, 2006
Filed:
Dec. 03, 2003
Don-gey Liu, Taichung, TW;
Tsong-jen Yang, Taichung, TW;
Chin-hao Yang, Taipei, TW;
Hong-yuan Hsu, Daan Hsiang, TW;
Wen Luh Yang, Chingshuei Jen, TW;
Giin-shan Chen, Taichung, TW;
Don-Gey Liu, Taichung, TW;
Tsong-Jen Yang, Taichung, TW;
Chin-Hao Yang, Taipei, TW;
Hong-Yuan Hsu, Daan Hsiang, TW;
Wen Luh Yang, Chingshuei Jen, TW;
Giin-Shan Chen, Taichung, TW;
Feng Chia University, Taichung, TW;
Abstract
A molding technique for copper interconnecting wires by electrochemical displacement deposition on the pre-shaped metal layer in accordance with the present invention is used to form an adhering layer on a substrate and a sacrificial layer on the adhering layer. The sacrificial layer is patterned according to the copper interconnecting wires and displaced to form the copper interconnecting wires in a specific chemical solution.