This inventor holds 2 USPTO granted patents and 1 published patent application. Top assignee: Feng Chia University. Active years: 2005-2006.
Company Filing History:
Years Active: 2005-2006
Title: Innovations of Giin-Shan Chen in Copper Interconnect Technology
Introduction
Giin-Shan Chen is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of electrochemical deposition techniques, particularly in the development of copper interconnecting wires. With a total of 2 patents, his work has implications for improving the efficiency and reliability of electronic components.
Latest Patents
Giin-Shan Chen's latest patents include innovative techniques that enhance the manufacturing process of copper interconnects. The first patent, titled "Molding technique for copper interconnecting wires by electrochemical displacement deposition on the pre-shaped metal layer," describes a method for forming an adhering layer on a substrate and a sacrificial layer on top of it. This sacrificial layer is then patterned to create copper interconnecting wires through a specific chemical solution.
The second patent, "Oxygen-removing pre-process for copper interconnect grown by electrochemical displacement deposition," outlines a process where deionized water is heated to remove dissolved oxygen before preparing plating solutions. This pre-process significantly improves the resistance of the copper grown from the EDD solutions, bringing it closer to the ideal value for copper.
Career Highlights
Giin-Shan Chen is affiliated with Feng Chia University, where he continues to advance research in materials science and engineering. His work is pivotal in the development of new technologies that enhance electronic manufacturing processes.
Collaborations
Giin-Shan Chen collaborates with esteemed colleagues, including Don-Gey Liu and Tsong-Jen Yang. Their combined expertise fosters an environment of innovation and research excellence.
Conclusion
Giin-Shan Chen's contributions to the field of electrochemical deposition and copper interconnect technology are noteworthy. His patents reflect a commitment to advancing electronic manufacturing processes, which can lead to more efficient and reliable electronic devices.