This inventor holds 2 USPTO granted patents. Top assignee: Feng Chia University. Active years: 2005-2006.
Company Filing History:
Years Active: 2005-2006
Title: Don-Gey Liu: Innovator in Copper Interconnect Technology
Introduction
Don-Gey Liu is a prominent inventor based in Taichung, Taiwan. He has made significant contributions to the field of electrochemical displacement deposition, particularly in the development of techniques for copper interconnecting wires. With a total of 2 patents, Liu's work is recognized for its innovative approaches to improving the efficiency and effectiveness of copper interconnects.
Latest Patents
Liu's latest patents include a molding technique for copper interconnecting wires by electrochemical displacement deposition on the pre-shaped metal layer. This invention focuses on forming an adhering layer on a substrate and a sacrificial layer on the adhering layer. The sacrificial layer is patterned according to the copper interconnecting wires and displaced to create the copper interconnecting wires in a specific chemical solution. Another notable patent is the oxygen-removing pre-process for copper interconnect grown by electrochemical displacement deposition. This process involves heating a solvent, such as deionized water, to remove dissolved oxygen before preparing plating solutions for copper interconnect growth. The resistance of the copper produced from the EDD solutions that have undergone this oxygen-removing process is significantly improved, approaching copper's ideal resistance value.
Career Highlights
Don-Gey Liu is affiliated with Feng Chia University, where he continues to advance research in his field. His work has garnered attention for its practical applications in electronics and materials science. Liu's innovative techniques are paving the way for more efficient manufacturing processes in the semiconductor industry.
Collaborations
Liu has collaborated with notable colleagues, including Tsong-Jen Yang and Chin-Hao Yang. These partnerships have contributed to the advancement of research and development in copper interconnect technology.
Conclusion
Don-Gey Liu's contributions to the field of electrochemical displacement deposition and copper interconnect technology highlight his role as an influential inventor. His innovative patents and collaborations continue to shape advancements in the industry.