Wen-Ling Chang

Title: Wen-Ling Chang: Innovator in Integrated Circuit Technology

Introduction

Wen-Ling Chang is a notable inventor based in Miaoli County, Taiwan. She has made significant contributions to the field of integrated circuit technology. Although she currently holds no granted patents, her innovative ideas are reflected in her latest patent applications.

Latest Patent Applications

One of her recent applications is titled "IC Structure with Stress-Release Pattern to Enhance Package Yield." This application describes an integrated circuit (IC) structure that includes a substrate with a circuit region and a chip corner region. The structure features IC devices formed on the substrate within the circuit region, a passivation layer over the IC devices, and a polyimide layer above the passivation layer. Notably, both the passivation layer and the polyimide layer incorporate a stress-release pattern in the chip corner region.

Another significant application is "SEMICONDUCTOR PACKAGE REDISTRIBUTION STRUCTURE AND FABRICATION METHOD THEREOF." This application outlines a semiconductor device that consists of an interconnect structure over a substrate and a redistribution layer above the interconnect structure. The redistribution layer includes a first via and a first metal line, along with a second via and a second metal line. The first metal line is designed to be wider than the second metal line, while both lines maintain equal thickness. Each metal line features a top portion with a conductive material of a first grain size and a bottom portion with a conductive material of a second grain size, where the first grain size is greater than the second.

Conclusion

Wen-Ling Chang is an innovative inventor whose work in integrated circuit technology showcases her potential in the field. Her latest patent applications reflect her commitment to advancing semiconductor technology.