Hsinchu, Taiwan

Wen-Li Cheng

This inventor holds 1 USPTO granted patent. Top assignee: Synopsys, Inc.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Wen-Li Cheng. Retrieved from https://idiyas.com/inventor/wen-li-cheng-wjukn99a

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Innovations of Wen-Li Cheng in Computational Lithography

Introduction

Wen-Li Cheng is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of computational lithography, particularly through his innovative patent. His work is essential for advancements in lithographic processes used in various technologies.

Latest Patents

Wen-Li Cheng holds a patent titled "Representing lithographic layouts using parametric curves." This patent focuses on a layout utilized in a computational lithography process. The layout may represent the lithographic mask or the desired resist shape. It consists of multiple disjoint shapes, with at least some represented by parametric curve representations instead of polygons or other rectilinear forms. These parametric curve representations are crucial for enhancing the computational lithography process. He has 1 patent to his name.

Career Highlights

Wen-Li Cheng is currently employed at Synopsys, Inc., where he continues to develop innovative solutions in the field of lithography. His expertise and contributions have positioned him as a key figure in his area of specialization.

Collaborations

Wen-Li Cheng collaborates with talented individuals in his field, including his coworker Yung-Yu Chen, who is also making strides in related research.

Conclusion

Wen-Li Cheng's work in computational lithography exemplifies the importance of innovation in technology. His contributions are paving the way for future advancements in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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