Hsinchu, Taiwan

Wen Kun Yang

This inventor holds 2 USPTO granted patents and 1 published patent application. Top assignee: King Dragon International Inc.. Active years: 2015-2017.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Wen Kun Yang. Retrieved from https://idiyas.com/inventor/wen-kun-yang-gr4ii1tv

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 2 

Average Co-Inventor Count = 1.3

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 2015-2017

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2 patents (USPTO):Explore Patents

Title: Innovations by Wen Kun Yang

Introduction

Wen Kun Yang is a notable inventor based in Hsin-Chu, Taiwan. He has made significant contributions to the field of semiconductor device packaging and LED technology. With a total of two patents to his name, Yang's work reflects his expertise and innovative approach in the industry.

Latest Patents

Yang's latest patents include a method for forming a semiconductor device package with slanting structures. This method involves providing a substrate with via contact pads and through holes, along with terminal pads on the substrate's bottom surface. A die with bonding pads is adhered to the substrate, and a dry film is formed on top of the die as a slanting structure. Additionally, a re-distribution layer conductive trace is created on the upper surface of the slanting structure through sputtering and E-plating.

Another significant patent is related to an LED package and its method. This process includes forming P-type and N-type through-holes in a substrate, applying conductive material on the sidewalls of these holes, and creating a reflective layer on the substrate's upper surface. The alignment of P-type and N-type pads with their respective through-holes is crucial for establishing electrical connections using copper refilling material.

Career Highlights

Wen Kun Yang is currently employed at King Dragon International Inc., where he continues to innovate and develop new technologies. His work has been instrumental in advancing semiconductor and LED packaging techniques, showcasing his commitment to excellence in engineering.

Collaborations

Yang collaborates with Yu-Hsiang Yang, who is also a key contributor in their projects. Their teamwork has led to the successful development of innovative solutions in their field.

Conclusion

Wen Kun Yang's contributions to semiconductor device packaging and LED technology highlight his role as a leading inventor in the industry. His patents demonstrate a commitment to innovation and excellence, making a significant impact on technology advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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