The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9117941 B1

PDF
Full Text
Expired
Date of Patent:
Aug. 25, 2015

Filed:

Sep. 12, 2014
Applicant:

King Dragon International Inc., Tortola, VG;

Inventors:

Wen Kun Yang, Hsin-Chu, TW;

Yu-Hsiang Yang, Hsin-Chu, TW;

Assignee:

King Dragon International Inc., Tortola, Virgin Islands, VG;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/28 (2006.01); H01L 33/36 (2010.01); H01L 33/44 (2010.01); H01L 33/00 (2010.01); H01L 21/768 (2006.01); H01L 33/60 (2010.01); H01L 23/00 (2006.01); H01L 33/48 (2010.01); H01L 33/62 (2010.01); H01L 33/64 (2010.01);
U.S. Cl.
CPC ...
H01L 33/005 (2013.01); H01L 21/76897 (2013.01); H01L 24/19 (2013.01); H01L 33/60 (2013.01); H01L 33/647 (2013.01); H01L 24/48 (2013.01); H01L 33/486 (2013.01); H01L 33/62 (2013.01); H01L 33/641 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/8592 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/3011 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0058 (2013.01); H01L 2933/0066 (2013.01);
Abstract

A method of LED package includes: forming a P-type through-hole and a N-type through-hole through a substrate; forming a conductive material on the sidewall of said P-type through-hole and N-type through-hole; forming a reflective layer on an upper surface of said substrate; aligning a P-type pad and a N-type pad with said P-type through-hole and said N-type through-hole, respectively, said P-type pad and N-type pad being formed on a first surface of a LED die, wherein said LED die is formed on said upper surface of said substrate; forming electrical connection from said P-type pad and said N-type pad by a copper refilling material within said P-type through-hole and said N-type through-hole; and a P-type terminal pad which positioned under said substrate electrically coupled to said P-type pad via said copper refilling material within said P-type through-hole, and a N-type terminal pad which positioned under said substrate electrically coupled to said N-type pad via said copper refilling material within said N-type through-hole.


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