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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9634180 B1

PDFFull Text
Expired
Date of Patent:
Apr. 25, 2017

Filed:

Dec. 21, 2014

Method for forming semiconductor device package with slanting structures

Applicant:

King Dragon International Inc., Tortola, BV;

Inventor:

Wen Kun Yang, Hsin-Chu, TW;

Assignee:

KING DRAGON INTERNATIONAL INC., Tortola, VG;

Attorneys:

Chih Feng Yeh

Huntington IP Consulting Co., Ltd.

Primary Examiner:

Natalia Gondarenko

Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 33/60 (2010.01); H01L 33/00 (2010.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 23/367 (2006.01);
U.S. Cl.
CPC ...
H01L 33/005 (2013.01); H01L 23/3677 (2013.01); H01L 23/49827 (2013.01); H01L 24/24 (2013.01); H01L 24/25 (2013.01); H01L 24/32 (2013.01); H01L 24/82 (2013.01); H01L 24/92 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H01L 2224/24225 (2013.01); H01L 2224/24998 (2013.01); H01L 2224/2518 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/73267 (2013.01); H01L 2224/83855 (2013.01); H01L 2224/92244 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/15151 (2013.01); H01L 2924/15747 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0058 (2013.01); H01L 2933/0066 (2013.01);
Abstract

A method for forming semiconductor device package comprises providing a substrate with via contact pads and via through holes through said substrate, terminal pads on a bottom surface of said substrate and an exposed type through hole through said substrate. A die is provided with bonding pads thereon and an exposed type pad on a bottom surface of said die. A reflective layer is formed on an upper surface of the substrate. The die is adhered on the substrate. A dry film is formed on a top of the die as a slanting structure. A re-distribution layer conductive trace is formed by sputtering and E-plating on an upper surface of the slanting structure.

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