Kaohsiung, Taiwan

Wen-Hsuan Lin

This inventor holds 3 USPTO granted patents. Top assignee: Nxp B.v.. Active years: 2018-2019.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Wen-Hsuan Lin. Retrieved from https://idiyas.com/inventor/wen-hsuan-lin-9anjifa3

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 2.4

ph-index = 2

Forward Citations = 6(Granted Patents)


Company Filing History:


Years Active: 2018-2019

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3 patents (USPTO):Explore Patents

Title: **Innovator Spotlight: Wen-Hsuan Lin from Kaohsiung, Taiwan**

Introduction

Wen-Hsuan Lin is a notable inventor based in Kaohsiung, Taiwan, recognized for his significant contributions to the field of integrated circuit (IC) packaging. With a total of three patents to his name, Lin's work showcases innovative methods that enhance the functionality and reliability of integrated circuits, making a substantial impact in the electronics industry.

Latest Patents

Wen-Hsuan Lin's latest patents include an innovative **IC packaging method** and a **packaged IC device**. The patent outlines a method for packaging IC dies, which involves several key steps: it starts with creating openings on a substrate, where the side surfaces are covered by metal layers. Following this, the IC dies are placed into the openings on the substrate, and a second metal layer is applied, establishing electrical connections with at least a portion of the second metal layer. Ultimately, the substrate is cut into individual IC devices.

Another patent focuses on **integrated circuits and methods therefor**, which covers the design of a chip carrier that has openings to align IC chips with an alignment feature. This allows for comprehensive testing of the IC chips, including assessments following stress conditions. Here, a test probe is expertly aligned to contacts on each chip, enabling thorough analysis of the IC chip's responsiveness.

Career Highlights

Wen-Hsuan Lin is currently associated with NXP B.V., a global semiconductor company known for its innovative solutions in the field of electronics. His work at NXP emphasizes his commitment to advancing the technology behind integrated circuits, reflecting the company's focus on cutting-edge innovation.

Collaborations

Throughout his career, Lin has collaborated with several notable coworkers, including Chung Hsiung Ho and Ju-Hsuan Ko. Their joint efforts contribute to a collaborative environment that fosters creativity and innovation, ultimately leading to the successful development of impactful technologies in the semiconductor industry.

Conclusion

Wen-Hsuan Lin stands as a pivotal figure in the realm of integrated circuit inventions, with patents that not only showcase his innovative spirit but also set the foundation for future advancements in the electronics field. His work continues to influence the industry, demonstrating the vital role inventors play in shaping technology and enhancing electronic systems globally.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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