The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 08, 2019

Filed:

Jan. 13, 2016
Applicant:

Nxp B.v., Eindhoven, NL;

Inventors:

Chung Hsiung Ho, Kaohsiung, TW;

Wen-Hsuan Lin, Kaohsiung, TW;

Ju-Hsuan Ko, Kaohsiung, TW;

Chih Hung Chang, Donggang, TW;

Assignee:

NXP B.V., Eindhoven, NL;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 1/04 (2006.01); G01R 31/28 (2006.01); H01L 21/683 (2006.01); H01L 21/56 (2006.01); H01L 21/78 (2006.01); H01L 23/544 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6835 (2013.01); G01R 1/0491 (2013.01); G01R 31/2867 (2013.01); G01R 31/2875 (2013.01); H01L 21/561 (2013.01); H01L 21/78 (2013.01); H01L 23/544 (2013.01); H01L 2221/68327 (2013.01);
Abstract

Aspects of the present disclosure are directed to methods and apparatuses involving a chip carrier having openings therein that align integrated circuit (IC) chips relative to an alignment feature. The IC chips and carrier are tested, such as by final testing the affixed IC chips after manufacture, and further testing after subjecting the affixed IC chips to one or more stress conditions. A test probe is aligned to one or more contacts on each chip based on the location of an alignment feature of the carrier relative to the opening in which the IC chip being tested is located. Responsiveness of the IC chip, before and after application of the one or more stress conditions, can be assessed by probing the IC chip via the aligned test probe, and assessing electrical signals received over the test probe.


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