Wen-Hsiung Chang

Title: Innovations of Wen-Hsiung Chang

Introduction

Wen-Hsiung Chang is a notable inventor based in Hsinchu County, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of four patents. His work focuses on innovative semiconductor package structures and manufacturing methods.

Latest Patents

Chang's latest patents include a semiconductor package structure and a manufacturing method thereof. This invention features a semiconductor package structure that comprises a sensor die, a substrate, a light blocking layer, a circuit layer, a dam structure, and an underfill. The sensor die is designed with a sensing surface that includes an image sensing area and multiple conductive bumps. The substrate is positioned on the sensing surface, while the light blocking layer is situated between the substrate and the sensor die. The circuit layer is placed on the light blocking layer, ensuring electrical connectivity between the sensor die and the circuit layer through the conductive bumps. Additionally, the dam structure surrounds the image sensing area, with its ends contacting both the sensor die and the light blocking layer. The underfill is located between the dam structure and the conductive bumps.

Another significant patent by Chang is a semiconductor package that includes several first chips, through silicon vias, at least one insulator, a first circuit structure, and a first encapsulant. Each first chip is electrically connected to the through silicon vias and features a sensing area on its active surface, along with a back surface and multiple through holes extending from the back surface to the active surface. An insulator is placed on the active surfaces of the first chips, while the first circuit structure is positioned on the back surfaces and connected to the through silicon vias. The first encapsulant laterally encapsulates the first chips.

Career Highlights

Wen-Hsiung Chang is currently employed at Powertech Technology Inc., where he continues to innovate in semiconductor technology. His work has significantly impacted the industry, leading to advancements in semiconductor packaging and manufacturing processes.

Collaborations

Chang collaborates with talented individuals such as Hung-Hsin Hsu and Nan-Chun Lin, who contribute to his projects and enhance the innovation process.

Conclusion

Wen-Hsiung Chang's contributions to semiconductor technology through his patents and collaborations highlight his role as a leading inventor in the field. His innovative approaches continue to shape the future of semiconductor packaging and manufacturing.