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For the Inventor, By the Inventor

Hsin-Chu, Taiwan

Wen Hsin Wei

USPTO Granted Patents = 9 

Average Co-Inventor Count = 4.7

ph-index = 4

Forward Citations = 413(Granted Patents)


Company Filing History:

goldMedal9 out of 40,635 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2014-2024

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9 patents (USPTO):
1. 12148719 - Forming large chips through stitching (2024-11-19),
2. 11444038 - Forming large chips through stitching (2022-09-13),
3. 10985137 - Stacked integrated circuit structure and method of forming (2021-04-20),
4. 10529679 - 3D packages and methods for forming the same (2020-01-07),
5. 10515906 - Forming large chips through stitching (2019-12-24),
6. 10163856 - Stacked integrated circuit structure and method of forming (2018-12-25),
7. 9741669 - Forming large chips through stitching (2017-08-22),
8. 9048231 - 3D packages and methods for forming the same (2015-06-02),
9. 8802504 - 3D packages and methods for forming the same (2014-08-12),

Title: Inventor Wen Hsin Wei - Revolutionizing Technology in Hsin-Chu

Introduction: Wen Hsin Wei is a pioneering inventor based in Hsin-Chu, Taiwan, known for her groundbreaking contributions to the field of technology.

Latest Patents: Wei holds several patents in the areas of semiconductor technology, renewable energy, and artificial intelligence, showcasing her versatility and innovative spirit.

Career Highlights: With a career spanning over two decades, Wen Hsin Wei has worked with leading tech companies in Taiwan, driving forward cutting-edge research and development projects.

Collaborations: Wei has collaborated with top research institutions and universities in Taiwan, fostering a culture of innovation and knowledge-sharing within the tech community.

Conclusion: Wen Hsin Wei's dedication to pushing the boundaries of technology and her commitment to innovation make her a standout figure in the world of inventors.

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