Wen-Cheng Liu

Title: Innovations of Wen-Cheng Liu in Polishing Technologies

Introduction

Wen-Cheng Liu is a notable inventor based in Linyuan Township, Kaohsiung County, Taiwan. He has made significant contributions to the field of polishing technologies, particularly in the semiconductor industry. With a total of 2 patents to his name, Liu's work focuses on improving the efficiency and effectiveness of polishing processes.

Latest Patents

Liu's latest patents include a method for polishing through-silicon via (TSV) wafers and a polishing composition used in this method. The method involves subjecting the surface of a TSV wafer to a polishing treatment with a composition that contains an organic alkaline compound, an oxidizing agent, silicon oxide abrasive particles, and a solvent. This innovative approach allows for the simultaneous polishing of silicon and conductive materials at higher removal rates, significantly reducing the working-hour costs associated with polishing TSV wafers. Additionally, he has developed a chemical mechanical polishing slurry designed to polish a copper layer without damaging the underlying barrier layer. This slurry includes an acid, a surfactant, and a silica sol with surface-modified silica polishing particles.

Career Highlights

Wen-Cheng Liu is currently employed at Cabot Microelectronics Corporation, where he continues to advance polishing technologies. His work has been instrumental in enhancing the performance and reliability of semiconductor devices.

Collaborations

Liu has collaborated with several talented individuals in his field, including Kang-Hua Lee and Hui-Fang Hou, who is a prominent female engineer. These collaborations have contributed to the development of innovative solutions in polishing technologies.

Conclusion

Wen-Cheng Liu's contributions to polishing technologies have made a significant impact on the semiconductor industry. His innovative methods and compositions are paving the way for more efficient manufacturing processes.