The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8167684 B1

PDF
Full Text
Expired
Date of Patent:
May. 01, 2012

Filed:

Aug. 27, 2007
Applicants:

Hui-fang Hou, Kaohsiung Science Park, TW;

Wen-cheng Liu, Kaohsiung Science Park, TW;

Yen-liang Chen, Kaohsiung Science Park, TW;

Jui-ching Chen, Kaohsiung Science Park, TW;

Inventors:

Hui-Fang Hou, Kaohsiung Science Park, TW;

Wen-Cheng Liu, Kaohsiung Science Park, TW;

Yen-Liang Chen, Kaohsiung Science Park, TW;

Jui-Ching Chen, Kaohsiung Science Park, TW;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B 1/00 (2006.01); B24C 1/00 (2006.01); B24D 3/02 (2006.01); C09K 3/14 (2006.01); C09G 1/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

A chemical mechanical polishing slurry for polishing a copper layer without excessively or destructively polishing a barrier layer beneath the copper layer is disclosed and includes an acid, a surfactant, and a silica sol having silica polishing particles that are surface modified with a surface charge modifier and that have potassium ions attached thereto. A method for preparing the chemical mechanical polishing slurry and a chemical mechanical polishing method using the chemical mechanical polishing slurry are also disclosed.


Find Patent Forward Citations

Hou, Hui-Fang. (2012). Chemical mechanical polishing slurry, its preparation method, and use for the same (U.S. Patent No. 8167684). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8167684

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…