Shanghai, China

Wen Bai



 

Average Co-Inventor Count = 3.7

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2015-2018

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3 patents (USPTO):

Title: Innovations by Inventor Wen Bai

Introduction

Wen Bai is a notable inventor based in Shanghai, China. He has made significant contributions to the field of colloidal silica, holding a total of 3 patents. His work focuses on improving the effectiveness of colloidal silica in various applications, particularly in papermaking.

Latest Patents

Wen Bai's latest patents include a method for producing high solids colloidal silica. This invention provides a method for enhancing the effectiveness of colloidal silica by carefully managing the removal of charged impurities. The method ensures that the colloid does not become a viscous gel while maintaining the necessary charged particles for optimal performance. Another significant patent involves the preparation of colloidal silicas with a low S-value and high solids content, specifically for use in papermaking. This invention allows for better retention and drainage performance, enabling the use of lower amounts of colloidal silicas compared to traditional methods.

Career Highlights

Throughout his career, Wen Bai has worked with prominent companies such as Ecolab and STMicroelectronics R&D in Shanghai. His experience in these organizations has contributed to his expertise in the field of colloidal silica and its applications.

Collaborations

Wen Bai has collaborated with several professionals in his field, including Jane B Wong Shing and Zhi Quan Chen. These collaborations have further enriched his research and development efforts.

Conclusion

Wen Bai's innovative work in colloidal silica has led to significant advancements in its production and application, particularly in the papermaking industry. His contributions continue to influence the field and demonstrate the importance of innovation in material science.

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