This inventor holds 2 USPTO granted patents and 5 published patent applications. Top assignee: Cisco Technology, Inc.. Active years: 2026.
Company Filing History:
Years Active: 2026
Title: Weiying Ding - Innovator in PCB Design
Introduction
Weiying Ding is an inventor based in Shanghai, CN. He has made significant contributions to the field of printed circuit board (PCB) design. His innovative approaches focus on enhancing performance and efficiency in high-density signaling applications.
Latest Patent Applications
Weiying Ding has filed several notable patent applications. One of his latest applications is titled "PCB WITH BREAKOUT TO ENABLE HIGHER DENSITY, LAYER COUNT AND ENHANCED PERFORMANCE." This application describes a PCB that includes a unique fanout pattern, which reduces cross-talk in a novel way while enabling effective power routing into the connector of the PCB. The design meets the 224 Gbps requirement for signal integrity and power integrity performance, addressing crosstalk, insertion loss, and return loss. Additionally, the techniques disclosed improve PCB density and eliminate the need for additional layer changing transition VIAs.
Another significant application is "POWER DELIVERY SYSTEM FOR HIGH DENSITY SIGNALING AND HIGH POWER DELIVERY APPLICATION." This design and process tackle power delivery challenges for PTH and one-step HDI designs. The application suggests that the quantity of layers and the thickness of the board may be reduced. In one embodiment, a PCB is back drilled, and round cap plating is performed to achieve a more uniform power plane. Furthermore, the back drilled section of a VIA is plated, providing a larger shape that is plated for power delivery.
Conclusion
Weiying Ding's innovative work in PCB design showcases his commitment to advancing technology in high-density applications. His latest patent applications reflect a deep understanding of the challenges in the field and propose effective solutions.