The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 2026

Filed:

Apr. 20, 2023
Applicant:

Cisco Technology, Inc., San Jose, CA (US);

Inventors:

Wenbin MA, Shanghai, CN;

Mike Sapozhnikov, San Jose, CA (US);

Weiying Ding, Shanghai, CN;

David Nozadze, San Jose, CA (US);

Yinxin Yang, Shanghai, CN;

Assignee:

CISCO TECHNOLOGY, INC., San Jose, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10W 20/41 (2026.01); H10W 20/00 (2026.01); H10W 20/20 (2026.01); H10W 72/00 (2026.01);
U.S. Cl.
CPC ...
H10W 20/427 (2026.01); H10W 20/023 (2026.01); H10W 20/20 (2026.01); H10W 72/823 (2026.01);
Abstract

In some aspects, the techniques described herein relate to an apparatus including: a semiconductor device substrate material; a first signal conductor incorporated into the semiconductor device substrate material; a second signal conductor incorporated into the semiconductor device substrate material; and a ground conductor incorporated into the semiconductor device substrate material between the first signal conductor and the second signal conductor, wherein the ground conductor includes a first elongated portion and a second elongated portion arranged at an angle relative to the first elongated portion.


Find Patent Forward Citations

Quick Actions:

MA, Wenbin. (2026). Via ground structures (U.S. Patent No. 12787745). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12787745

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