Company Filing History:
Years Active: 2017-2025
Title: Weijing Lu: Innovator in Copper Electroplating Technologies
Introduction
Weijing Lu, an esteemed inventor based in Hong Kong, China, has made significant contributions in the field of electroplating. With a portfolio of nine patents, Lu has focused on enhancing the efficiency and effectiveness of copper electroplating baths through innovative chemical formulations.
Latest Patents
Lu's latest patents underscore his expertise in copper electroplating technologies. One notable invention is a copper electroplating bath containing compounds of reaction products of amines, polyacrylamides, and sultones. This innovative formulation allows for high throwing power in electroplating processes while reducing nodules on copper deposits. Another significant patent involves a similar copper electroplating bath containing only reaction products of amines and polyacrylamides, further highlighting his commitment to improving electromechanical properties and finish quality in electroplating applications.
Career Highlights
Throughout his career, Weijing Lu has collaborated with renowned companies, including Rohm and Haas Electronic Materials and Dow Global Technologies. His work in these organizations has allowed him to push the boundaries of existing technologies, resulting in advancements that have broadened the application of electroplating in various industries.
Collaborations
Lu has had the opportunity to work alongside talented professionals, such as Maria Anna Rzeznik and Lingli Duan. Their collaborative efforts have contributed to the development of innovative solutions in the electroplating sector, reflecting the synergy of expertise that often leads to groundbreaking inventions.
Conclusion
In summary, Weijing Lu represents a pioneering spirit in the realm of copper electroplating technologies. His continuous dedication to innovation is evident through his patents, which offer practical solutions for industry challenges. As he advances in his career, the impact of his work is likely to resonate throughout the field, inspiring future advancements in electroplating and beyond.