The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 2020
Filed:
Oct. 08, 2015
Applicants:
Dow Global Technologies Llc, Midland, MI (US);
Rohm and Haas Electronic Materials Llc, Marlborough, MA (US);
Inventors:
Weijing Lu, Fanling, HK;
Lingli Duan, Pudong District, CN;
Zukhra Niazimbetova, Marlborough, MA (US);
Chen Chen, Pudong District, CN;
Maria Rzeznik, Marlborough, MA (US);
Assignee:
Rohm and Haas Electronic Materials LLC, Marlborough, MA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 3/38 (2006.01); C25D 3/58 (2006.01); C08G 73/02 (2006.01); C25D 3/56 (2006.01); C23C 18/16 (2006.01); C25D 7/12 (2006.01); H01L 21/288 (2006.01); H01L 21/768 (2006.01); H05K 3/42 (2006.01);
U.S. Cl.
CPC ...
C25D 3/38 (2013.01); C08G 73/024 (2013.01); C25D 3/56 (2013.01); C25D 3/58 (2013.01); C23C 18/1653 (2013.01); C25D 7/123 (2013.01); H01L 21/2885 (2013.01); H01L 21/76879 (2013.01); H05K 3/424 (2013.01); H05K 2203/0723 (2013.01);
Abstract
A polymer composed of a reaction product of an amine and a quinone. The quinone is a Michael addition receptor. The polymer may be an additive for a copper electroplating bath. The polymer may function as a leveler and enable the copper electroplating bath to have high throwing power and provide copper deposits with reduced nodules.