Wei-Wen Lai

Title: Innovations of Wei-Wen Lai in Capacitive and Magnetic Coupling Technologies.

Introduction

Wei-Wen Lai is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of electrical engineering, particularly in the development of innovative package structures for isolators. With a total of two patents to his name, his work showcases advancements in capacitive and magnetic coupling technologies.

Latest Patents

Wei-Wen Lai's latest patents include a "Package structure of capacitive coupling isolator" and a "Magnetic coupling package structure for magnetically coupled isolator with duo leadframes and method for manufacturing the same." The first patent describes a package structure that includes a first and second leadframe, a transmitter, a receiver, and a packaging body. This design allows for the formation of multiple capacitors through the alignment of electrode plates. The second patent outlines a method for manufacturing a magnetic coupling package structure, which involves steps for leadframe provision, chip connection, and coil alignment to control the coupling effect between two coil portions.

Career Highlights

Wei-Wen Lai is currently employed at Lite-On Singapore Pte. Ltd., where he continues to innovate in the field of isolator technologies. His work has been instrumental in enhancing the performance and reliability of electronic devices.

Collaborations

He has collaborated with notable coworkers, including You-Fa Wang and Pu-Han Lin, contributing to the advancement of their shared projects and innovations.

Conclusion

Wei-Wen Lai's contributions to capacitive and magnetic coupling technologies reflect his expertise and commitment to innovation. His patents not only advance the field but also pave the way for future developments in electronic isolators.