The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 21, 2020

Filed:

Oct. 19, 2018
Applicant:

Lite-on Singapore Pte. Ltd., Midview, SG;

Inventors:

You-Fa Wang, Singapore, SG;

Wei-Wen Lai, Kaohsiung, TW;

Pu-Han Lin, New Taipei, TW;

Yuan-Lung Wu, New Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H04B 5/00 (2006.01); H02M 3/07 (2006.01); H02M 3/06 (2006.01); G08C 17/06 (2006.01); H01L 23/66 (2006.01); H04L 25/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49537 (2013.01); H01L 23/49541 (2013.01); H01L 23/49589 (2013.01); G08C 17/06 (2013.01); H01L 23/49534 (2013.01); H01L 23/49575 (2013.01); H01L 23/66 (2013.01); H02M 3/06 (2013.01); H02M 3/07 (2013.01); H04B 5/005 (2013.01); H04B 5/0031 (2013.01); H04L 25/0266 (2013.01);
Abstract

A package structure for a capacitive coupling isolator is provided. The package structure includes a first and a second leadframes, a transmitter, a receiver and a packaging body. The first leadframe includes a first and a second signal input pins and a first electrode plate, and the second leadframe includes a first and a second signal output pins and a second electrode plate. The first and second electrode plates are arranged one above another and aligned with each other for forming a plurality of capacitors. The transmitter is disposed on the first leadframe and the receiver is disposed on the second leadframe. The packaging body encloses the first and second leadframes and is filled therebetween for electrically isolating the first and second leadframes from each other.


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