The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 17, 2019

Filed:

Jul. 20, 2018
Applicant:

Lite-on Singapore Pte. Ltd., Midview, SG;

Inventors:

You-Fa Wang, Singapore, SG;

Wei-Wen Lai, Kaohsiung, TW;

Pu-Han Lin, New Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/16 (2006.01); H01L 25/065 (2006.01); H01L 23/495 (2006.01); H01L 25/00 (2006.01); H01L 23/31 (2006.01); H01L 23/66 (2006.01); H01F 38/14 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01F 38/14 (2013.01); H01L 21/56 (2013.01); H01L 23/3121 (2013.01); H01L 23/495 (2013.01); H01L 23/49537 (2013.01); H01L 23/49541 (2013.01); H01L 23/49575 (2013.01); H01L 23/66 (2013.01); H01L 25/16 (2013.01); H01L 25/50 (2013.01); H01L 24/48 (2013.01); H01L 2223/6611 (2013.01); H01L 2223/6661 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48245 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06531 (2013.01); H01L 2225/06572 (2013.01); H01L 2924/19042 (2013.01);
Abstract

The instant disclosure includes a magnetic coupling package structure with duo leadframes for a magnetically coupled isolator and a method for manufacturing the same. The method includes a leadframe providing step, a chip connecting step and a coil alignment step. The leadframe providing step includes providing a first and a second leadframe each including a chip carrying portion, a coil portion, a plurality of pins and floating pins. The chip connecting step includes disposing at least a first chip and at least a second chip onto the corresponding chip carrying portions for electrically connecting the chips to the pins. The coil alignment step includes arranging the first leadframe above or beneath the second leadframe and applying a first and a second magnetic field to the first and the second leadframes respectively for aligning the coil portions, thereby controlling the coupling effect between two coil portions.


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