Taichung, Taiwan

Wei-Shen Hung

USPTO Granted Patents = 1 

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Innovations by Wei-Shen Hung: A Glimpse into His Patent and Contributions

Introduction

Wei-Shen Hung is an esteemed inventor based in Taichung, Taiwan, known for his significant contribution to the field of electronic packaging. With one patent to his name, he has made strides in enhancing the manufacturing methods associated with electronic components. His relentless pursuit of innovation is reflected in his groundbreaking work at Siliconware Precision Industries Co., Ltd.

Latest Patents

Hung's prominent patent, titled "Electronic package and manufacturing method thereof," introduces a novel electronic package design. This patent details an innovative approach where an electronic element is placed on the upper side of a circuit structure. A package layer covers this element, while an action structure is embedded within the package layer. This design allows for the action structure to be exposed at the surface level, facilitating efficient thermal conduction. By employing a bonding element positioned on the lower side of the circuit structure, which corresponds to the action structure, heat energy can effectively be transferred via a laser to the bonding element, enabling the reflow of solder material.

Career Highlights

Wei-Shen Hung’s career is marked by his dedication to research and development in the realm of electronic packaging. His work with Siliconware Precision Industries Co., Ltd. has been pivotal in driving advancements in manufacturing techniques, ultimately benefiting the broader electronics industry. His patented invention showcases his ability to merge engineering principles with practical applications.

Collaborations

Throughout his career, Hung has collaborated closely with esteemed colleagues such as Tai-Shin Renn and Kuo-Hua Yu. Their combined expertise in the field garners a significant enhancement of the innovative capabilities within the company. Together, they work toward pushing the boundaries of technology in electronic packaging solutions.

Conclusion

In summary, Wei-Shen Hung stands out as a significant figure in the field of electronic packaging innovation. Through his patent and collaborative efforts, he continues to impact the industry positively. His work not only provides solutions but also lays the groundwork for future advancements in electronic manufacturing.

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