Siliconware Precision Industries Co., Ltd.

Wei-Shen Hung

Kuo-Hua Yu

Yu-Min Lo

Tai-Shin Renn

An electronic package is provided, in which an electronic element is disposed on an upper side of a circuit structure, a package layer covers the electronic element, and an action structure is embedded in the package layer, so that the action structure is exposed from a surface of the package layer, and then a bonding element is disposed on a lower side of the circuit structure and corresponding to the position of the action structure, so as to form a thermal conduction between the bonding element and the action structure. Therefore, a laser can transfer heat energy to the bonding element via the action structure, so that a solder material on the bonding element can be reflowed.

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Taichung, Taiwan

Wei-Shen Hung