This inventor holds 1 USPTO granted patent and 6 published patent applications. Top assignee: United Microelectronics Corp.. Active years: 2026.
Company Filing History:
Years Active: 2026
Title: Innovations of Wei-Ren Huang
Introduction
Wei-Ren Huang is a notable inventor based in Changhua, Taiwan. He has made significant contributions to the field of semiconductor technology. His work primarily focuses on the development of innovative wafer designs that enhance testing and manufacturing processes.
Latest Patents
Wei-Ren Huang holds a patent for a "Wafer with test structure and method of dicing wafer." This invention includes a wafer with a front side and a back side, featuring multiple dice and a scribe line positioned between them. The design incorporates a first dielectric layer and a first metal connection within the first dielectric layer. Additionally, a test structure and a dielectric layer are placed on the scribe line, enhancing the wafer's functionality. The invention also includes trenches that facilitate connections and a grinding tape that covers the front side of the wafer, ensuring contact with the test structure. This patent showcases his innovative approach to improving wafer technology.
Career Highlights
Wei-Ren Huang is currently associated with United Microelectronics Corporation, a leading company in the semiconductor industry. His role at the company allows him to apply his expertise in wafer technology and contribute to advancements in semiconductor manufacturing.
Collaborations
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Conclusion
Wei-Ren Huang's contributions to wafer technology through his patent demonstrate his innovative spirit and commitment to advancing the semiconductor industry. His work continues to influence the field and pave the way for future developments.