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For the Inventor, By the Inventor

Lansdale, PA, United States of America

Wei Qin

USPTO Granted Patents = 13 

Average Co-Inventor Count = 3.2

ph-index = 2

Forward Citations = 11(Granted Patents)


Location History:

  • Lansfale, PA (US) (2019)
  • Lansdale, PA (US) (2010 - 2020)
  • Ambler, PA (US) (2022 - 2024)

Company Filing History:

goldMedal13 out of 211 
 
Kulicke and Soffa Industries, Inc.
 patents

Years Active: 2010-2024

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13 patents (USPTO):Explore Patents
1. 12183711 - Methods of determining a sequence for creating a plurality of wire loops in connection with a workpiece (2024-12-31),
2. 12113043 - Methods of calibrating an ultrasonic characteristic on a wire bonding system (2024-10-08),
3. 11935864 - Methods of optimizing clamping of a semiconductor element against a support structure on a wire bonding machine, and related methods (2024-03-19),
4. 11865633 - Methods of operating a wire bonding machine, including methods of monitoring an accuracy of bond force on a wire bonding machine, and related methods (2024-01-09),
5. 11597031 - Methods of operating a wire bonding machine, including methods of monitoring an accuracy of bond force on a wire bonding machine, and related methods (2023-03-07),
6. 11515285 - Methods of optimizing clamping of a semiconductor element against a support structure on a wire bonding machine, and related methods (2022-11-29),
7. 11289448 - Methods for generating wire loop profiles for wire loops, and methods for checking for adequate clearance between adjacent wire loops (2022-03-29),
8. 10672735 - Methods for generating wire loop profiles for wire loops, and methods for checking for adequate clearance between adjacent wire loops (2020-06-02),
9. 10665564 - On-bonder automatic overhang die optimization tool for wire bonding and related methods (2020-05-26),
10. 10325878 - Methods for generating wire loop profiles for wire loops, and methods for checking for adequate clearance between adjacent wire loops (2019-06-18),
11. 10121759 - On-bonder automatic overhang die optimization tool for wire bonding and related methods (2018-11-06),
12. 8302840 - Closed loop wire bonding methods and bonding force calibration (2012-11-06),
13. 7735716 - Method of controlling the trajectory of a bonding tool during the formation of a wire loop (2010-06-15),

Title: The Innovative Mind of Wei Qin

Introduction

Wei Qin, an accomplished inventor based in Lansdale, PA, has made significant contributions to the field of wire bonding technology. With a remarkable portfolio of 13 patents, his innovative methods have advanced the efficiency and accuracy of wire bonding systems. Throughout his career, Wei has demonstrated a commitment to pushing the boundaries of engineering and technology.

Latest Patents

Wei Qin's latest patents showcase his expertise in wire bonding processes. One significant invention is a method for determining a sequence for creating a plurality of wire loops in connection with a workpiece. This innovative method involves analyzing workpiece data, such as bonding location positions and wire loop configurations, to optimize the creation of wire loops. By addressing various factors like overlap conditions and wire loop positions, Wei has paved the way for improved wire loop creation processes.

Another noteworthy patent by Wei focuses on calibrating an ultrasonic characteristic on a wire bonding system. This method encompasses determining reference ultrasonic characteristics for optimal wire bond formation and achieving a non-stick wire bond condition. By establishing calibration factors based on reference data, Wei's patent contributes significantly to enhancing the reliability of wire bonding systems.

Career Highlights

Wei Qin currently works at Kulicke and Soffa Industries, Inc., a leading company in the wire bonding equipment industry. His role involves developing new technologies that align with the company’s goals of enhancing wire bonding processes for semiconductor applications. Wei's focus on innovation has positioned him as a vital asset to his organization and the industry as a whole.

Collaborations

Throughout his career, Wei has collaborated with prominent colleagues such as Ziauddin Ahmad and Hui Xu. These partnerships have fostered a collaborative environment where ideas can flourish, further driving advancements in wire bonding technology.

Conclusion

Wei Qin stands as a testament to the power of innovation in technology. With his extensive patent portfolio and commitment to developing cutting-edge solutions, he continues to make significant contributions to the wire bonding industry. His work not only improves existing processes but also inspires future inventors and engineers to push the boundaries of what is possible.

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