The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 06, 2018
Filed:
Aug. 11, 2016
Kulicke and Soffa Industries, Inc., Fort Washington, PA (US);
Aashish Shah, Horsham, PA (US);
Robert William Ellenberg, Philadelphia, PA (US);
Stephen Babinetz, Lansdale, PA (US);
Ziauddin Ahmad, Villanova, PA (US);
Wei Qin, Lansdale, PA (US);
Kulicke and Soffa Industries, Inc., Fort Washington, PA (US);
Abstract
A method of providing a z-axis force profile applied to a plurality of bonding locations during a wire bonding operation is provided. The method includes: (a) determining a z-axis force profile for each of a plurality of bonding locations on an unsupported portion of at least one reference semiconductor device; and (b) applying the z-axis force profile during subsequent bonding of a subject semiconductor device. Methods of: determining a maximum bond force applied to a bonding location during formation of a wire bond; and determining a z-axis constant velocity profile for formation of a wire bond, are also provided.