Company Filing History:
Years Active: 2018-2020
Title: The Innovations of Robert William Ellenberg
Introduction
Robert William Ellenberg is a notable inventor based in Philadelphia, PA (US). He has made significant contributions to the field of semiconductor technology, particularly in wire bonding processes. With a total of 2 patents, Ellenberg's work has advanced the efficiency and effectiveness of wire bonding operations.
Latest Patents
Ellenberg's latest patents include an innovative tool known as the "On-bonder automatic overhang die optimization tool for wire bonding and related methods." This method provides a z-axis force profile applied to multiple bonding locations during a wire bonding operation. The process involves determining a z-axis force profile for each bonding location on an unsupported portion of a reference semiconductor device and applying this profile during the bonding of a subject semiconductor device. Additionally, the patent outlines methods for determining the maximum bond force applied during the formation of a wire bond and establishing a z-axis constant velocity profile for the same.
Career Highlights
Ellenberg is currently employed at Kulicke and Soffa Industries, Inc., where he continues to innovate in the field of semiconductor manufacturing. His work has been instrumental in enhancing the reliability and performance of wire bonding techniques.
Collaborations
Ellenberg has collaborated with notable colleagues such as Aashish Shah and Stephen Babinetz, contributing to a dynamic work environment that fosters innovation and creativity.
Conclusion
Robert William Ellenberg's contributions to wire bonding technology exemplify the impact of innovative thinking in the semiconductor industry. His patents and ongoing work at Kulicke and Soffa Industries, Inc. continue to shape the future of this critical field.