Lansdale, PA, United States of America

Stephen Babinetz

USPTO Granted Patents = 6 

Average Co-Inventor Count = 2.5

ph-index = 4

Forward Citations = 146(Granted Patents)


Company Filing History:


Years Active: 2007-2020

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6 patents (USPTO):

Title: The Innovations of Stephen Babinetz

Introduction

Stephen Babinetz is a notable inventor based in Lansdale, PA (US). He has made significant contributions to the field of semiconductor technology, holding a total of 6 patents. His work primarily focuses on advancements in wire bonding techniques, which are crucial for the manufacturing of semiconductor devices.

Latest Patents

One of Stephen Babinetz's latest patents is the "On-bonder automatic overhang die optimization tool for wire bonding and related methods." This innovative method provides a z-axis force profile applied to multiple bonding locations during a wire bonding operation. The process involves determining a z-axis force profile for each bonding location on an unsupported portion of at least one reference semiconductor device. Subsequently, this profile is applied during the bonding of a subject semiconductor device. Additionally, the patent includes methods for determining the maximum bond force applied to a bonding location during the formation of a wire bond, as well as establishing a z-axis constant velocity profile for the wire bond formation.

Career Highlights

Stephen Babinetz is currently employed at Kulicke and Soffa Industries, Inc., where he continues to innovate in the field of semiconductor manufacturing. His expertise in wire bonding technology has positioned him as a key player in the industry.

Collaborations

Throughout his career, Stephen has collaborated with talented individuals such as Takashi Tsujimura and Hiroyuki Ohtsubo. These collaborations have further enhanced the development of advanced technologies in wire bonding.

Conclusion

Stephen Babinetz's contributions to the field of semiconductor technology through his patents and collaborations highlight his role as an influential inventor. His work continues to impact the industry positively, paving the way for future innovations in wire bonding techniques.

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