The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 29, 2022
Filed:
Apr. 22, 2020
Applicant:
Kulicke and Soffa Industries, Inc., Fort Washington, PA (US);
Inventors:
Basil Milton, Furlong, PA (US);
Wei Qin, Ambler, PA (US);
Assignee:
Kulicke and Soffa Industries, Inc., Fort Washington, PA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 23/528 (2006.01);
U.S. Cl.
CPC ...
H01L 24/85 (2013.01); H01L 21/48 (2013.01); H01L 21/4889 (2013.01); H01L 23/528 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 24/05 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/45014 (2013.01); H01L 2224/4847 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48095 (2013.01); H01L 2224/48463 (2013.01); H01L 2224/4917 (2013.01); H01L 2224/49052 (2013.01); H01L 2224/49111 (2013.01); H01L 2224/49171 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/859 (2013.01); H01L 2224/85123 (2013.01); H01L 2224/85125 (2013.01); H01L 2224/85127 (2013.01); H01L 2224/85129 (2013.01); H01L 2924/00014 (2013.01);
Abstract
A method of generating a wire loop profile in connection with a semiconductor package is provided. The method includes the steps of: (a) providing package data related to the semiconductor package; and (b) creating a loop profile of a wire loop of the semiconductor package, the loop profile including a tolerance band along at least a portion of a length of the wire loop.