The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 06, 2012
Filed:
Oct. 05, 2007
Wei Qin, Lansdale, PA (US);
Ziauddin Ahmad, Villanova, PA (US);
John David Molnar, Ambler, PA (US);
Deepak Sood, New Britain, PA (US);
E. Walter Frasch, Perkasie, PA (US);
Chunlong HU, Los Angeles, CA (US);
Wei Qin, Lansdale, PA (US);
Ziauddin Ahmad, Villanova, PA (US);
John David Molnar, Ambler, PA (US);
Deepak Sood, New Britain, PA (US);
E. Walter Frasch, Perkasie, PA (US);
Chunlong Hu, Los Angeles, CA (US);
Kulicke and Soffa Industries, Inc., Fort Washington, PA (US);
Abstract
A method of applying bonding energy to form a bond between a portion of a wire and a contact of a bonding location using a wire bonding machine is provided. The method includes: (1) moving a bonding tool towards the contact; (2) detecting when a portion of the contact () is pressed against a device supporting surface () of the wire bonding machine; and (3) applying bonding energy to the portion of the contact such that a bond is formed between the contact and the portion of wire.