Wei-Ming Hung

Title: Innovations of Wei-Ming Hung in Power Semiconductor Technology.

Introduction

Wei-Ming Hung is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of power semiconductor technology. His innovative approach has led to the development of a unique semiconductor package that enhances efficiency and reduces costs.

Latest Patents

Wei-Ming Hung holds a patent for a power semiconductor package unit utilizing surface mount technology. This invention includes a chip, a plastic film layer, and an electroplated layer. The design features a front side and a back side of the chip, each equipped with a signal contact. The plastic film layer covers the chip and incorporates a first via and a second via. The first via is positioned adjacent to the chip, while the second via extends to the signal contact on the front side. A conductive layer is integrated into both the first and second vias. The conductive layer in the second via connects electrically to the signal contact on the front side. Through the electroplated layer, the signal contact on the back side is linked to the conductive layer in the first via. This innovative design allows the conductive layer to protrude from the plastic film layer as conductive terminals. The invention successfully achieves electrical connection of the chip without the need for expensive die bonding materials.

Career Highlights

Wei-Ming Hung is currently employed at Panjit International Inc., where he continues to advance semiconductor technology. His work has garnered attention for its practical applications and cost-saving benefits.

Collaborations

Wei-Ming collaborates with talented colleagues, including Chung-Hsiung Ho and Wen-Liang Huang, who contribute to the innovative environment at Panjit International Inc.

Conclusion

Wei-Ming Hung's contributions to power semiconductor technology exemplify the spirit of innovation. His patent reflects a significant advancement in the field, showcasing his ability to create efficient and cost-effective solutions.