Wei Li Wu

Title: Innovations of Wei Li Wu

Introduction

Wei Li Wu is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the development of bonding wafer structures. His innovative work has led to the filing of a patent that showcases his expertise and creativity in this specialized area.

Latest Patents

Wei Li Wu holds a patent for a bonding wafer structure and method of manufacturing the same. This patent describes a bonding wafer structure that includes a support substrate, a bonding layer, and a silicon carbide (SiC) layer. The bonding layer is formed on the surface of the support substrate, with the SiC layer bonded onto the bonding layer. Notably, the carbon surface of the SiC layer is in direct contact with the bonding layer. The SiC layer features a basal plane dislocation (BPD) ranging from 1,000 ea/cm to 20,000 ea/cm, and it has a total thickness variation (TTV) greater than that of the support substrate. The bonding wafer structure achieves a TTV of less than 10 μm, a bow of less than 30 μm, and a warp of less than 60 μm.

Career Highlights

Wei Li Wu is currently employed at GlobalWafers Co., Ltd., where he continues to advance his research and development efforts in semiconductor technologies. His work has been instrumental in enhancing the performance and reliability of wafer bonding processes.

Collaborations

Wei Li Wu collaborates with talented colleagues, including Ying-Ru Shih and Hung-Chang Lo. These partnerships foster a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Wei Li Wu's contributions to the field of semiconductor technology through his patent and collaborative efforts highlight his role as a significant inventor. His work continues to influence advancements in bonding wafer structures, showcasing the importance of innovation in this industry.