Hsinchu, Taiwan

Wei-Jin Li

USPTO Granted Patents = 2 

Average Co-Inventor Count = 4.2

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2021

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2 patents (USPTO):Explore Patents

Title: Innovations of Wei-Jin Li in Semiconductor Technology

Introduction

Wei-Jin Li is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, holding two patents that showcase his innovative methods. His work primarily focuses on improving the gap-fill capability in semiconductor structures.

Latest Patents

Wei-Jin Li's latest patents include a method for forming an isolation structure with enhanced gap-fill capability. This method involves patterning a semiconductor substrate to create semiconductor fins and depositing dielectric materials to form an isolation structure. The process ensures that the trench between the fins is effectively filled, enhancing the overall performance of semiconductor devices. Another patent details a gap-fill method that utilizes atomic layer deposition to improve the filling of trenches between semiconductor fins, further advancing semiconductor fabrication techniques.

Career Highlights

Wei-Jin Li is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His expertise in semiconductor structures has positioned him as a valuable asset to the company, contributing to its reputation for innovation and quality.

Collaborations

Throughout his career, Wei-Jin Li has collaborated with esteemed colleagues such as Wan-Yi Kao and Chung-Chi Ko. These partnerships have fostered a collaborative environment that encourages the exchange of ideas and advancements in semiconductor technology.

Conclusion

Wei-Jin Li's contributions to semiconductor technology through his innovative patents and collaborations highlight his role as a key inventor in the field. His work continues to influence the development of advanced semiconductor structures, paving the way for future innovations.

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