Wei-Huan Fu

Title: Wei-Huan Fu: Innovator in Semiconductor Technology

Introduction

Wei-Huan Fu is a notable inventor based in Tainan, Taiwan. He has made significant contributions to the field of semiconductor technology. His innovative work has led to the development of a unique semiconductor device that enhances performance and reliability.

Latest Patents

Wei-Huan Fu holds a patent for a semiconductor device and method of forming the same. This semiconductor device includes a device layer, a first passivation layer, an aluminum pad, a second passivation layer, an under-ball metallurgy (UBM) pad, and a connector. The device layer is disposed over a substrate and includes a top metal feature. The first passivation layer is placed over the device layer, while the aluminum pad penetrates through the first passivation layer and is electrically connected to the top metal feature. The second passivation layer is positioned over the aluminum pad, and the UBM pad penetrates through the second passivation layer, connecting electrically to the aluminum pad. The connector is situated over the UBM pad. Notably, in some embodiments, the first included angle between a sidewall and the bottom of the aluminum pad is greater than the second included angle between a sidewall and the bottom of the UBM pad. He has 1 patent to his name.

Career Highlights

Wei-Huan Fu is currently employed at Taiwan Semiconductor Manufacturing Company Limited. His work at this leading semiconductor manufacturer has allowed him to collaborate with other talented professionals in the industry.

Collaborations

Some of his coworkers include Ying-Tsung Chen and Jiun-Jie Huang. Their collective expertise contributes to the innovative environment at Taiwan Semiconductor Manufacturing Company Limited.

Conclusion

Wei-Huan Fu is a prominent figure in semiconductor innovation, with a patent that showcases his technical expertise and creativity. His contributions continue to impact the semiconductor industry positively.