Wei-Hsun Liao

Title: Innovations of Wei-Hsun Liao

Introduction

Wei-Hsun Liao is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology. His innovative work has led to the development of a unique interposer device that enhances semiconductor package structures.

Latest Patents

Wei-Hsun Liao holds a patent for an interposer device and semiconductor package structure. This invention comprises two bump regions, a channel region, a plurality of signal lines, and a plurality of ground lines. The two bump regions are respectively coupled to two semiconductor devices, while the channel region connects the two bump regions. The signal lines are embedded in the bump regions and channel region, facilitating the transmission of circuit signals. Additionally, the ground lines provide shielding for the signal lines. Each signal line in the bump regions consists of a trunk portion, a turning portion, and a signal turning point, optimizing the device's functionality.

Career Highlights

Throughout his career, Wei-Hsun Liao has worked with prominent companies in the semiconductor industry. He has been associated with Global Unichip Corporation and Taiwan Semiconductor Manufacturing Company Ltd. His experience in these organizations has contributed to his expertise in semiconductor technologies.

Collaborations

Wei-Hsun Liao has collaborated with talented individuals in his field, including Hao-Yu Tung and Sheng-Fan Yang. These collaborations have fostered innovation and advancement in semiconductor technology.

Conclusion

Wei-Hsun Liao's contributions to semiconductor technology through his innovative patent and collaborations highlight his importance in the field. His work continues to influence advancements in semiconductor packaging and device functionality.