This inventor holds 1 USPTO granted patent. Top assignee: Chipbond Technology Corporation. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Innovations by Wei-Hsin Wu in Semiconductor Technology
Introduction
Wei-Hsin Wu is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology. His innovative work has led to the development of a unique semiconductor package that enhances bonding strength and alignment.
Latest Patents
Wei-Hsin Wu holds a patent for a semiconductor package and chip thereof. This semiconductor package includes a flexible circuit board and a chip featuring a first bump group and a second bump group. The design ensures that the second bumps are longer than the first bumps, which increases the bonding strength to the leads on the flexible circuit board. This innovation prevents the leads from shifting and separating from the bumps, thereby reducing the risk of lead bonding misalignment. He has 1 patent to his name.
Career Highlights
Wei-Hsin Wu is currently employed at Chipbond Technology Corporation, where he continues to work on advancing semiconductor technologies. His expertise in this field has made him a valuable asset to the company.
Collaborations
He collaborates with talented coworkers, including Ku-Pang Chang and Chun-Chia Yeh, who contribute to the innovative projects at Chipbond Technology Corporation.
Conclusion
Wei-Hsin Wu's contributions to semiconductor technology exemplify the importance of innovation in enhancing product performance and reliability. His work continues to influence the industry positively.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile